Patent · US Active

Method for producing a semi-conductor arrangement and corresponding semi-conductor arrangement

US9905533B2 · kind B2 · utility

0Cited by

5References

8Claims

0Family size

Assignee

AUDI AG · DE

Inventors

Günter Vetter · Burladingen, DE
Andreas Apelsmeier · Pollenfeld, DE
Henning Suckel · Birkenfeld, DE

Key dates

Filing date	Jul 8, 2015
Grant date	Feb 27, 2018
Priority date	—
Expiry date	Jul 8, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3512
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a semiconductor arrangement, said method includes fastening a semiconductor on a base element by means of a sintered layer, wherein a side of the sintered layer which faces the base element is configured planar; and perforating a region of the base element, which directly contacts the sinter, wherein the perforating includes generating a plurality of through-openings having a closed border in the region of the base element for adjusting a stiffness of at least a portion of the base element in a targeted manner

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.