Multi-layer wideband antenna with integrated impedance matching
US9906202B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Feb 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio-frequency (RF) antenna with wideband impedance matching includes a first conductive layer, a second conductive layer, and patterned connections. The first conductive layer is formed on a first surface of a dielectric material. The second conductive layer is formed on a second surface of the dielectric material. The patterned connections between the first conductive layer and the second conductive layer are formed through multiple vias to enable the wideband impedance matching. The first conductive layer and the second conductive layer are formed based on an antenna-layout pattern. The multiple vias are formed based on a via pattern that corresponds to the antenna-layout pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.