PCB with two rows of solder pads including both SMT-based and DIP-based structures
US9907187B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2017 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Jul 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.