High-power electronic module and method for making such a module
US9907199B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 4, 2015 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit with a smaller thermal contact area than the contact area between the first face and the support, and a first and a second support. The first component in each pair is supported by the first support and is connected to a second electrical circuit of the second support and the second component in each pair is supported on the second support and is connected to a first electrical circuit of the first support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.