Method for producing a heat exchanger module with at least two fluid circulation circuits and heat exchanger obtained using this method
US9908206B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 3, 2013 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Oct 27, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/061
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an novel method of producing heat exchangers having at least two fluid circuits each comprising channels, the method employing diffusion bonding achieved using the hot isostatic pressing (HIP) technique, and to a heat exchanger obtained using this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.