Multilayer capacitors, method for making multilayer capacitors
US9908817B2 · kind B2 · utility
1Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2012 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Jul 3, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.