Patent · US Active

Bonding compositions

US9909039B2 · kind B2 · utility

0Cited by

8References

17Claims

0Family size

Assignee

HENKEL IP & HOLDING GMBH · DE

Inventors

Darren Nolan · Dublin, IE
Eimear Fleming · Dublin, IE
Deirdre Ledwith · Dublin, IE
Brendan Kneafsey · Lucan, IE
John Walsh · Durham, US
Eimear Finnigan · Skerries, IE

Key dates

Filing date	Mar 13, 2015
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Mar 13, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L61/28
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

There is provided a curable composition comprising one or more reactive components that cure upon exposure to suitable conditions, the curable composition comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.