Patent · US Active

Plating bath compositions for electroless plating of metals and metal alloys

US9909216B2 · kind B2 · utility

1Cited by

8References

19Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heiko Brunner · Berlin, DE
Lars Kohlmann · Berlin, DE
Sengül KARASAHIN · Berlin, DE
Matthias Dammasch · Berlin, DE
Simon PAPE · Berlin, DE
Sandra Lucks · Berlin, DE

Key dates

Filing date	Dec 4, 2015
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Dec 4, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C18/48
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.