Patent · US Active

Conduit spacing and mounting system and method

US9909692B2 · kind B2 · utility

3Cited by
12References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 28, 2015
Grant dateMar 6, 2018
Priority date
Expiry dateDec 28, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH02G3/32
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A conduit spacing and mounting system and method are provided for prefabricating multilayered assemblies of conduits and mounting them end-to-end in a building. The system includes a pair of spacer plates, each having a same pattern of conduit-receiving openings, and a plurality of clamping assemblies, each including a bracket which is discrete from and individually attached to the spacer plate adjacent to one of the conduit-receiving openings. The clamping assemblies are oriented at different angles relative at different rows of the conduit-receiving openings to provide access for a clamp-tightening tool in the spaces between different rows of conduits. The use of spacer plates largely prevents lateral misalignments between the conduits, and the use of a separate bracket formed from a harder, stronger or thicker metal than the spacer plate greatly increases the strength and reliability of the clamping force applied to the conduits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.