Thermal conductivity control devices
US9909823B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2013 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In the first position the first conduction body is spaced apart from the second conduction body, thermally isolating the heat source from the heat sink. In the second position the first conduction body thermally contacts the second conduction body, and conducts heat from the heat source, through the conduction bodies and into the heat sink. Related methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.