Patent · US Active

Pressure sensor system

US9909946B2 · kind B2 · utility

1Cited by

12References

21Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Jan Ihle · Grambach, AT
Andreas Peschka · Michendorf, DE
Bert Hundertmark · Stahnsdorf, DE
Benjamin Bohl · Berlin, DE
Bernhard Ostrick · Teltow, DE

Key dates

Filing date	Dec 14, 2016
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Dec 14, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48091
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.