Patent · US Active

Thickness determination and layer characterization using terahertz scanning reflectometry

US9909986B2 · kind B2 · utility

3Cited by

23References

8Claims

0Family size

Assignee

Applied Research and Photonics, Inc. · US

Inventors

Anis Rahman · Irvine, US
Aunik K. Rahman · Hummelstown, US

Key dates

Filing date	Jul 9, 2015
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Jul 9, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG02F2203/13
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.