Micro-perforation overmolding gate
US9910460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Mar 7, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/34
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.