Through-body-via isolated coaxial capacitor and techniques for forming same

US9911689B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kevin J. Lee · Beaverton, US
• Ruchir Saraswat · Swindon, GB
• Uwe Zillmann · Braunschweig, DE
• Nicholas P. Cowley · Wroughton, GB
• Andre Schaefer · Hersbruck, DE
• Rinkle Jain · Portland, US
• Guido Droege · Braunschweig, DE

Key dates

• Filing date: Dec 23, 2013
• Grant date: Mar 6, 2018
• Expiry date: Dec 23, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).