Patent · US Active

Embedded packages

US9911700B2 · kind B2 · utility

8Cited by

0References

34Claims

0Family size

Assignee

Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. · CN

Inventors

Dror Hurwitz · Zhuhai, CN
Alex Huang · Zhuhai, CN

Key dates

Filing date	Jan 26, 2016
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Jan 26, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure consisting of at least one die embedded in a polymer matrix and surrounded by the matrix, and further consisting of at least one through via through the polymer matrix around perimeter of the die, wherein typically the at least one via has both ends exposed and where the die is surrounded by a frame of a first polymer matrix and the at least one through via passes through the frame; the die is positioned with terminals on a lower surface such that the lower surface of the chip is coplanar with a lower surface of the frame, the frame is thicker than the chip, and metal is directly attached to and covers at least part of the upper surface of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.