Electrostatic chuck assemblies capable of bidirectional flow of coolant and semiconductor fabricating apparatus having the same
US9912258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2015 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Feb 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck assembly, including an electrostatic chuck on which a substrate is loaded; a channel that provides a flow passage for coolant in the electrostatic chuck, the channel having a first opening at a first end corresponding to a center of the substrate and a second opening at a second end corresponding to an edge of the substrate; and a valve box to control a flow direction of the coolant in the channel, the valve box including a first supply valve to control an introduction of the coolant into the first opening; a first return valve to control a drainage of the coolant from the second opening; a second supply valve to control an introduction of the coolant into the second opening; and a second return valve to control a drainage of the coolant from the first opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.