Patent · US Active

Method of manufacturing an encapsulation device

US9912313B2 · kind B2 · utility

0Cited by

1References

14Claims

0Family size

Assignee

Micro Crystal SA · CH

Inventors

Léa Deillon · Lausanne, CH
Silvio Dalla Piazza · La Chaux-de-Fonds, CH
Thierry Hessler · Neuchâtel, CH

Key dates

Filing date	Oct 23, 2012
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Nov 9, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49574
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.