Thermal capacitance system
US9913411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2016 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.