Additive manufacturing device
US9914292B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2015 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | May 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is an additive manufacturing device that facilitates the manufacturing of relatively large 3D objects at a short time. The device uses radiation-curable resin and radiation curing system. Layer shaping members are disclosed to provide both for shorter manufacturing time of an object, minimizing waste of resin and reduction of weight. Curing radiation sources are also designed to minimizing waste of resin and manufacturing time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.