Head and liquid ejecting apparatus with electrically connecting bumps
US9914300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2016 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A head including a channel formation substrate is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid; a piezo element includes a first electrode which is provided on one surface side of a channel formation substrate, a piezoelectric layer is provided on the first electrode, and a second electrode is provided on the piezoelectric layer; and a driving circuit board is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element, in which the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board, and in which the bump and the adhesive layer are provided above the piezoelectric layer of the piezo element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.