Patent · US Active

MEMS component including a sound-pressure-sensitive diaphragm element

US9914636B2 · kind B2 · utility

3Cited by

1References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Thomas Buck · Tamm, DE
Fabian Purkl · Gerlingen, DE
Michael Stumber · Ditzingen, DE
Rolf Scheben · Stuttgart, DE
Benedikt Stein · Stuttgart, DE
Christoph Schelling · Stuttgart, DE

Key dates

Filing date	Jul 18, 2016
Grant date	Mar 13, 2018
Priority date	—
Expiry date	Jul 18, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.