Patent · US Active

Sensor package

US9914638B2 · kind B2 · utility

0Cited by

9References

13Claims

0Family size

Assignee

Sensirion AG · CH

Inventors

David Pustan · Zürich, CH
Werner Hunziker · Männedorf, CH

Key dates

Filing date	Jan 12, 2016
Grant date	Mar 13, 2018
Priority date	—
Expiry date	Jan 12, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.