Targeted control of the absorption behavior during laser resealing
US9914640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.