Ink composition
US9914844B2 · kind B2 · utility
0Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2015 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Apr 25, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D11/38
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is provided an ink composition, including: a combination of specific dyes, in which the dynamic contact angle of the ink to a silicon wafer is 24° or lower at 100 msec after dropping, and is 9° or lower at 5,100 msec after dropping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.