Patent · US Active

Method for molding a body in a mold

US9914859B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

tesa SE · DE

Inventors

Stephan Bernt · Hamburg, DE
Patrick Kerep · Hamburg, DE

Key dates

Filing date	Jul 14, 2015
Grant date	Mar 13, 2018
Priority date	—
Expiry date	Jul 14, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2477/006
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Method for molding a body in a mold, comprising the following steps: applying an adhesive tape to the inside of a mold, distributing the layers of material forming the body over the adhesive tape, curing the layers of material, removing the body from the mold, where the adhesive tape has a backing on one side of which a self-adhesive has been applied in the form of a polymer mixture, the polymers being constructed of 60 to 99.5 wt % of n-butyl acrylate and/or 2-ethylhexyl acrylate, 0.5 to 10 wt % of an ethylenically unsaturated monomer having an acid or acid-anhydride function, 0 to 30 wt % of one or more olefinic monomers and the self-adhesive comprises between 0 and 60 parts by weight of one or more tackifiers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.