Patent · US Active

Stripping compositions for removing photoresists from semiconductor substrates

US9914902B2 · kind B2 · utility

4Cited by

1References

27Claims

0Family size

Assignee

Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

Bing Du · Gilbert, US
Thomas Dory · Gilbert, US
William A. Wojtczak · Santa Clara, US

Key dates

Filing date	Dec 28, 2015
Grant date	Mar 13, 2018
Priority date	—
Expiry date	Mar 17, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC11D2111/22
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

This disclosure relates to photoresist stripping compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one alcohol solvent; 3) at least one quaternary ammonium hydroxide; 4) water; 5) at least one copper corrosion inhibitor selected from 6-substituted-2,4-diamino-1,3,5-triazines; and 6) optionally, at least one defoaming surfactant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.