Optical module with a dual layer PCBA structure
US9915780B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.