Systems and methods for flexible components for powered cards and devices
US9916992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2013 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Feb 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The flexible die may be applied to a mechanical carrier (e.g., a PCB) of a card or device. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. Such detection circuitry may cause a reaction to the changed characteristics by controlling other components on the card or device based upon the flex-induced changed characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.