Heat dissipater for main heat generating device with peripheral heat generating devices
US9917029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2013 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.