Method and apparatus for cooling a semiconductor device
US9917034B2 · kind B2 · utility
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14References
15Claims
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Key dates
| Filing date | Sep 26, 2014 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jan 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.