Substrate features for enhanced fluidic assembly of electronic devices
US9917226B1 · kind B1 · utility
12Cited by
26References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2016 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.