Electrical contact structure for a semiconductor component, and semiconductor component
US9917229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2015 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | May 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1).Furthermore, a semiconductor component (100) comprising a contact structure (10) is specified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.