Light emitting diode package structure, backlight module and display device
US9917233B2 · kind B2 · utility
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0References
15Claims
0Family size
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Key dates
| Filing date | Aug 1, 2014 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jul 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a light emitting diode (LED) package structure, a backlight module and a display device, and relates to the field of display technologies. The LED package structure includes an encapsulation housing and an LED chip encapsulated in the encapsulation housing. The encapsulation housing is a polyhedron which includes at least one inclined plane. One inclined plane of the encapsulation housing is a light exiting surface of the LED package structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.