Encapsulation package, display device and packaging method
US9917254B2 · kind B2 · utility
3Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Aug 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/861
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An OLED encapsulation package, a display device and a packaging method are disclosed. The OLED encapsulation package includes a substrate, a cover board and a encapsulation unit located between the substrate and the cover board; the substrate is provided with display components thereon, and the encapsulation unit encapsulates the periphery of the display components; the encapsulation unit includes at least a moisture sensitive layer therein, and the moisture sensitive layer is capable of discoloring upon encountering with water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.