Integrated circuit package with radio frequency coupling arrangement

US9917372B2 · kind B2 · utility

Assignee

• NXP USA, Inc. · US

Inventors

• Ziqiang Tong · Ottobrunn, DE
• Ralf Reuter · Landshut, DE

Key dates

• Filing date: Jun 13, 2014
• Grant date: Mar 13, 2018
• Expiry date: Sep 21, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/107
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.