Patent · US Active

Segmented focal plane array architecture

US9918023B2 · kind B2 · utility

14Cited by

40References

24Claims

0Family size

Assignee

FLIR Systems, Inc. · US

Inventors

Brian B. Simolon · Lompoc, US
Eric A. Kurth · Lompoc, US
Mark Nussmeier · Goleta, US
Nicholas Högasten · Lompoc, US
Theodore R. Hoelter · Goleta, US
Katrin Strandemar · Rimbo, SE
Pierre Boulanger · Goleta, US
Barbara Sharp · Lompoc, US

Key dates

Filing date	Dec 13, 2013
Grant date	Mar 13, 2018
Priority date	—
Expiry date	May 16, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/809
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.