Method and apparatus for preparing a surface for bonding a material thereto
US9919502B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Apr 21, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2400/166
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for preparing a surface of a substrate for bonding a material to the surface. The apparatus employed includes one or more optical amplification devices (OAD), one or more drivers, the substrate and a base. The one or more OAD and/or the substrate are moveably coupled to the one or more drivers. The one or more OAD is activated to emit a beam of energy. The one or more OAD and/or the substrate move relative to one another while the one or more OAD is activated. The movement of the one or more OAD and/or the substrate relative to one another forms (via the beam of energy) a pattern on the surface of the substrate. The pattern formed on the surface of the substrate allows the material to bond with a greater degree of adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.