MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head
US9919522B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Sep 7, 2016 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Sep 23, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.