Embossing tool and methods of preparation
US9919553B2 · kind B2 · utility
9Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2015 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The present invention is directed to an embossing tool having a microstructure on its surface wherein the surface of the embossing tool has a thin layer of gold or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.