Patent · US Active

Adhesion promoting agents for metallization of substrate surfaces

US9920432B2 · kind B2 · utility

1Cited by

1References

22Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Thomas Thomas · Dingwall, GB
Lutz Brandt · Maintal, DE
Lutz Stamp · Berlin, DE
Hans-Jürgen Schreier · Velten, DE

Key dates

Filing date	Dec 5, 2012
Grant date	Mar 20, 2018
Priority date	—
Expiry date	Jan 22, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02T50/60
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.