Positive-type photosensitive resin composition, and insulating film and OLED formed using the same
US9921476B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
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Key dates
| Filing date | Sep 24, 2012 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/124
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention relates to a positive-type photosensitive resin composition which includes an alkali soluble polyimide resin, a diazide-based photosensitive compound and a sensitivity enhancer, and in which the use of a polyimide resin wherein the degree of imidization of imidized polyimide resin is 50˜75% exhibits a light transmittance of 95% or more in the visible light wavelength range (400˜650 nm) as well as high developability in a patterning process, and to an insulating film and an OLED formed using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.