Method for manufacturing housing
US9921620B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Nov 10, 2016 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Nov 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.