Power module with double-sided cooling
US9922911B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | May 19, 2017 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | May 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a power module with double-sided cooling, comprising a semiconductor chip disposed between an upper substrate and a lower substrate; a first power lead disposed between the upper substrate and the semiconductor chip; a signal lead disposed between the upper substrate and the semiconductor chip, and spaced apart from the first power lead; a second power lead disposed between the lower substrate and the semiconductor chip; and a separation plate disposed between the first power lead, the signal lead, and the semiconductor chip; wherein the separation plate connects the first power lead with the semiconductor chip via a first hole formed through the separation plate, and connects the signal lead and the semiconductor chip via a second hole formed through the separation plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.