Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration
US9922956B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
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Key dates
| Filing date | Sep 26, 2014 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Sep 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.