Method for producing an LED module and LED module

US9923129B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Martin Reiss · Radeberg, DE
• Simon Schwalenberg · Regensburg, DE

Key dates

• Filing date: Aug 7, 2013
• Grant date: Mar 20, 2018
• Expiry date: Jan 12, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.