Patent · US Active

Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer

US9924601B2 · kind B2 · utility

3Cited by

2References

14Claims

0Family size

Assignee

LPKF LASER & ELECTRONICS AG · DE

Inventors

Roman Ostholt · Langenhagen, DE
Robin Alexander Krueger · Hannover, DE
Bernd Roesener · Porta Westfalica, DE
Eugen Haumann · Seelze, DE

Key dates

Filing date	Dec 3, 2013
Grant date	Mar 20, 2018
Priority date	—
Expiry date	Apr 7, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0113
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.