Dual cure epoxy adhesives
US9926476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2016 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Jun 13, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J11/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A dual cure, all epoxy adhesive that is both photochemically and thermally curable is disclosed. The adhesive may comprise at least about 93% by weight of one or more polymerizable epoxides, a catalytic amount of a photo-acid generator (PAG) configured to induce acid-catalyzed polymerization of the polymerizable epoxide when exposed to UV or visible light, about 0.01% to about 1% by weight of a redox agent, and a catalytic amount of a thermal acid generator (TAG) configured to induce acid-catalyzed polymerization of the polymerizable epoxide in the presence of the redox agent when exposed to a temperature at or above about 70° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.