Multi-chip device with temperature control element for temperature calibration
US9927266B2 · kind B2 · utility
1Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2012 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D3/0365
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.