High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same
US9927311B2 · kind B2 · utility
6Cited by
3References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 3, 2014 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0271
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-sensitivity sensor containing cracks is provided. The high-sensitivity sensor is obtained by forming microcracks on a conductive thin film, which is formed on top of a support, wherein the microcracks form a micro joining structure in which the microcracks are electrically changed, short-circuited or open, thereby converting external stimuli into electric signals by generating a change in a resistance value. The high-sensitivity sensor can be useful in a displacement sensor, a pressure sensor, a vibration sensor, artificial skin, a voice recognition system, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.