Computing device bonding assemblies
US9927847B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2016 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Oct 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/062
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.